进行中...

2024芯原(成都)Inter of Hardware Release实习生招聘

Inter of Hardware Release
2019-07-17
'员工福利好,办公环境好,发展平台好'
150-210每天 成都 硕士 5天/周 面议 实习6个月

芯原(成都)

成都

职位描述

Responsibility:

1. The process includes but not limited RTL package building/RTL linting/functional regression/synthesis/timing check/formal equivalence check/gate-level simulation/performance check/power check/

2. Help to run the regression and collect the report, update the status in time.

3. As a IP/Chip level release qualification engineer, who will be the last step before hardware release, thus it is with high responsibility to make sure there is no any bugs/violations through the flows.

 

Requirements:

1. Basic knowledge on IC design flow and design language like verilog, familiar with RTL/Gate level simulation.

2. Basic knowledge on FPGA

3. Can do some script programming for process automation

4. Strong responsibility, self motivation, and teamwork are essential.

5. Fluent English in speaking, reading and writing.

6. Work at least 4 days per week.
工作地点
高新区天府软件园C10栋23楼
查看更多职位>>
小白实习提醒你:
在招聘、录用期间要求你支付费用的行为都必须提高警惕。以招聘为名的培训、招生,许诺推荐其他工作机会,甚至提供培训贷款,或者 支付体检、服装、押金和培训等费用后才能录用工作的,都属于违法行为,应当提高警惕。一经发现,请立即举报,并向当地公安机关报案。

选择简历